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dc.contributor.authorMohd Khairuddin, Md Arshad
dc.date.accessioned2010-10-06T02:20:10Z
dc.date.available2010-10-06T02:20:10Z
dc.date.issued2006-06
dc.identifier.citationp.4-5en_US
dc.identifier.issn1823-9633
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/9705
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.relation.ispartofseriesExploreen_US
dc.relation.ispartofseriesJune 2006en_US
dc.subjectEnviron -- Penerbitan Universitien_US
dc.subjectUniMAP -- Publicationsen_US
dc.subjectUniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitaren_US
dc.subjectUniMAP -- Research and developmenten_US
dc.subjectUnder bump metallurgy (UBM)en_US
dc.subjectWafer bumpingen_US
dc.titleWafer bumping: A comparative technologies studyen_US
dc.typeArticleen_US
dc.publisher.departmentPejabat Timbalan Naib Canselor (Penyelidikan dan Inovasi)en_US


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