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Extended reliability of gold and copper ball bonds in microelectronic packaging
(World Gold Council, 2013-06)
Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years ...
Precise alignment of individual single-walled carbon nanotube using dielectrophoresis method for development and fabrication of pH sensor
(Hindawi Publishing Corporation, 2013)
Development and fabrication of single-walled carbon nanotube (SWNT) based pH sensor were reported. The precise alignment of individual SWNT using dielectrophoresis method between the two microgap electrodes was conducted, ...
Micropump pattern replication using Printed Circuit Board (PCB) technology
(Taylor and Francis Group, LLC., 2013-06-01)
This article shows a low-cost rapid hot embossing poly (methylmeth acrylate) (PMMA)-based micropump replication with printed circuit board (PCB) mold. PCB material offers advantages of low cost, rigid, and rapid thermal ...
Highly selective molecular imprinted polymer (MIP) based sensor array using interdigitated electrode (IDE) platform for detection of mango ripeness
(Elsevier B.V., 2013)
Detection of mango ripeness was performed by developing a highly selective molecularly imprinted polymers (MIP) layer combined with interdigitated electrode (IDE) as sensor. Mango volatiles from different week of ripeness ...
The thermal expansion behaviors of Cu-SiCp composites
(Trans Tech Publications, 2013)
The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak ...
Synthesis and characterization of electroless copper coated SiC particles
(Trans Tech Publications, 2013)
Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ...
The corrosion studies of powder metallurgy Co-Cr-Mo (F-75) alloy
(AENSI Publisher All rights reserved, 2013-10)
Co-Cr-Mo (F-75) alloy was investigated for biomedical application due to its mechanical properties and good corrosion resistance. This study has been focusing on the corrosion behavior of PM Co-Cr-Mo alloy. The Co-Cr-Mo ...
Bidirectional flow micropump based on dynamic rectification
(Elsevier B.V., 2013)
This paper proposes a new bidirectional pumping principle based on a dynamic rectification mechanism. The pump is composed of a moveable actuation platform and a gourd-shaped chamber, whose role is to behave as both a ...
Fabrication of silicon nitride ion sensitive field-effect transistor for pH measurement and DNA immobilization/hybridization
(Hindawi Publishing Corporation, 2013)
The fabrication of ion sensitive field-effect transistor (ISFET) using silicon nitride (Si3N4) as the sensing membrane for pH measurement and DNA is reported. For the pH measurement, the Ag/AgCl electrode was used as the ...
Sol-gel derived ZnO nanoparticulate films for ultraviolet photodetector (UV) applications
(Elsevier GmbH, 2013-11)
Zinc oxide nanoparticles based UV detector was fabricated on thermally oxidized silicon substrate. ZnO nanoparticle films were deposited using sol-gel route. The seed solution was prepared using two different solvents ...