Browsing Institute of Nano Electronic Engineering (INEE) (Articles) by Subject "Component reliability"
Now showing items 1-1 of 1
-
Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
(Springer Science+Business Media New York, 2013-08)Extended reliability and mechanical characterisation of Au and Pd-coated Cu (Cu) ball bonds are useful technical information for Au and Cu wire deployment in semiconductor device packaging. This paper discusses the influence ...