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IEC: shaping the future of global standardisation and conformity assessment & the way forward for industry 4.0

dc.contributor.authorHuey, Alex Looi Tink
dc.date.accessioned2019-10-11T02:10:00Z
dc.date.available2019-10-11T02:10:00Z
dc.date.issued2019-07
dc.identifier.citationp. 16-20en_US
dc.identifier.issn0126-9909
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/62375
dc.descriptionLink to publisher’s homepage at https://www.myiem.org.my/en_US
dc.language.isoenen_US
dc.publisherThe Institution of Engineers, Malaysia (IEM)en_US
dc.relation.ispartofseriesJurutera;2019 (7)
dc.subjectEngineersen_US
dc.subjectEngineers -- Bulletinen_US
dc.subjectIEM bulletinen_US
dc.subjectInternational Electrotechnical Commission (IEC)en_US
dc.subjectInternational Electrotechnical Commission (IEC) -- Standardsen_US
dc.subjectIndustry 4.0en_US
dc.titleIEC: shaping the future of global standardisation and conformity assessment & the way forward for industry 4.0en_US
dc.typeArticleen_US
dc.identifier.urlhttps://www.myiem.org.my/


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