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    Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders 

    Norainiza, Saud; Azman, Jalar (Universiti Malaysia Perlis, 2009-12-01)
    The microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. ...

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    AuthorAzman, Jalar (1)Norainiza, Saud (1)SubjectAnnealing (1)Diffusion (1)Microelectronics (1)
    Microelectronics packaging (1)
    Sn-Ag (1)... View MoreDate Issued
    2009 (1)

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