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Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
(Universiti Malaysia Perlis, 2009-12-01)
The microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. ...