Now showing items 1-2 of 2
Evaluation on metal matrix composite of CuSiC as candidate for thermal management materials in electronics packaging
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)
In the quest to pack into ever shrinking cell phone, digital audio players or personal digital assistance (PDA), which will definitely helps to ensure the electronic equipment does not overheat, fail or malfunction, ...
The outcome of sintering parameters study toward the thermal properties of CuSiC composite
(Trans Tech Publications, 2014)
Miniaturisation of electronic chips which have increasing functionality within the same package size has induced significant increases in requirements for extraction of heat from the integrated circuit (IC). Packaging ...