Now showing items 1-2 of 2

    • Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication 

      Muhamad Hafiz, Zan @ Hazizi; Mohd Arif Anuar, Mohd Salleh; Zainal Arifin, Ahmad, Prof.; Mohd Mustafa Al-Bakri, Abdullah; Alida, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (Trans Tech Publications, 2013)
      The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
    • Effect of space holder and compaction pressure on the porosity of sintered copper 

      Shamsul Baharin, Jamaludin, Prof. Dr.; Chong, Xin Yi; Alida, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (Trans Tech Publications, 2013)
      The effect of space-holder content on the porosity of sintered copper that was fabricated by powder metallurgy technique has been investigated. Carbamide was used as space-holder and the content selected was 10 wt. %, 20 ...