The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak ...

Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ...

The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. ...

The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates ...