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    • Cu-SiCp composites as advanced electronic packaging materials 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al Bakri, Abdullah; Sandu, A.V. (Trans Tech Publications, 2014)
      The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. ...