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Surface roughness and wettability correlation on etched platinum using reactive ion ecthing
(Trans Tech Publications, 2014-01)
As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated ...
Physical characterization of BST with different (x') ratios
(Trans Tech Publications, 2014)
Nowdays Barium strontium titanate (BST) can be applied into many fields of engineering. Its properties attracted more researchers to research and apply it into many fields of study. In this work, sol-gel method of preparing ...
Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer
(Trans Tech Publications, 2014)
Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
(Trans Tech Publications, 2014)
This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...