Browsing Khairul Anwar Mohamad Khazali, Dr. by Subject "Reactive Ion Etching (RIE)"
Now showing items 1-3 of 3
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Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
(Trans Tech Publications, 2014)This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ... -
Surface roughness and wettability correlation on etched platinum using reactive ion ecthing
(Trans Tech Publications, 2014-01)As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated ... -
Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer
(Trans Tech Publications, 2014)Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...