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    • Natural heat convection analysis on cylindrical Al slug of LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah; Nazuhusna, Khalid (Trans Tech Publications, 2014-01)
      This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...