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Bump height at low temperature analysis
(Trans Tech Publications (TTP), 2013)
The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)
Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...