Now showing items 1-2 of 2

    • The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint 

      Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin (MDPI AG, 2021-02)
      The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ...
    • Research development of solder materials and its intermetallic compound (IMC) study 

      Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...