Browsing Mohd Mustafa Al Bakri Abdullah, Prof. Dr. by Subject "Copper matrix composites"
Now showing items 1-1 of 1
-
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
(Trans Tech Publications, 2014-01)The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates ...