Now showing items 1-3 of 3

    • Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints 

      Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Mayappan, Ramani; Noor Farhani, Mohd Alui (Trans Tech Publications, 2013)
      Varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminium beverage cans were successfully reincorporated into Sn-0.7Cu base matrix solder material via powder metallurgy ...
    • Research advances of composite solder material fabricated via powder metallurgy route 

      Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
    • Research development of solder materials and its intermetallic compound (IMC) study 

      Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...