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    Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives 

    Li-Ngee, Ho; Hiroshi, Nishikawa; Tadashi, Takemoto (Universiti Malaysia Perlis, 2009-12-01)
    Electrically conductive adhesives (ECA) containing Cu-P and Cu as metallic filler, respectively, were studied in term of electrical properties and thermal stability. Both metallic fillers used in this study were prepared ...

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    AuthorHiroshi, Nishikawa (1)Li-Ngee, Ho (1)Tadashi, Takemoto (1)SubjectAging (1)Conductive adhesive (1)Copper (1)Electrical properties (1)Metallic fillers (1)... View MoreDate Issued
    2009 (1)

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