Browsing Ho Li Ngee, Dr. by Subject "Aging"
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Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
(Universiti Malaysia Perlis, 2009-12-01)Electrically conductive adhesives (ECA) containing Cu-P and Cu as metallic filler, respectively, were studied in term of electrical properties and thermal stability. Both metallic fillers used in this study were prepared ...