Browsing Ho Li Ngee, Dr. by Author "holingee@yahoo.com"
Now showing items 1-6 of 6
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Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
Li-Ngee, Ho; Hiroshi, Nishikawa; Tadashi, Takemoto (Universiti Malaysia Perlis, 2009-12-01)Electrically conductive adhesives (ECA) containing Cu-P and Cu as metallic filler, respectively, were studied in term of electrical properties and thermal stability. Both metallic fillers used in this study were prepared ... -
Enhanced photocatalytic activity of fish scale loaded TiO 2 composites under solar light irradiation
Ho, Li Ngee; Ong, Soon-An; Hakimah, Osman; Chong, Fong-Mun (Elsevier B.V., 2012-06)Fish scale (FS) loaded TiO2 composites were investigated as photocatalysts in degradation of Methyl Orange under solar light irradiation. Composites were prepared through sol-gel method by varying mass ratio of TiO2/FS at ... -
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
Ho, Li Ngee, Dr.; Hiroshi, Nishikawa (Springer Science+Business Media New York, 2013-06)Effects of post curing and silane coupling agents with different functional groups such as epoxy, isocyanate and ureide on the electrical and mechanical properties of copper (Cu) filled electrically conductive adhesives ... -
Photocatalytic degradation of reactive black 5 by fish scale-loaded TiO 2 composites
Ho, Li Ngee; Ong, Soon-An; Yee, Lin See (Springer Science+Business Media B.V., 2012-09)Titania and TiO 2/fish scale composites at different mass ratios (90:10, 70:30, and 50:50) were prepared by sol-gel method for application as photocatalysts in this study. Fish scale, synthesized TiO 2, and TiO 2/fish scale ... -
Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
Ho, Li Ngee, Dr.; Teng, Fei Wu; Hiroshi, Nishikawa (Taylor and Francis Group, LLC., 2013-11)In this study, a phenolic-based Ag flake-filled electrically conductive adhesive (ECA) was investigated in terms of rheological, electrical, and mechanical properties. To clarify the effect of various Ag flake filler content ... -
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications
Ho, Li Ngee; Nishikawa, Hiroshi (TMS, 2012-09)In this study, a simple one-step microwave-assisted method was developed to synthesize Cu and Cu-Ag particles for application in electrically conductive adhesive (ECA). The particle size of the obtained Cu particles was ...