Now showing items 1-2 of 2
Relationship between controllable process parameters on bump height in ENIG
(Trans Tech Publications, 2013)
This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ...
Bump height at low temperature analysis
(Trans Tech Publications (TTP), 2013)
The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...