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    5mm × 5mm sized slug on high power LED stress and junction temperature analysis 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid (Trans Tech Publications (TTP), 2013)
    Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...
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    Shear speed analysis on Sn-3.9Ag-0.6Cu Solder 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran (Trans Tech Publications (TTP), 2013)
    Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...

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    AuthorEhkan, Phaklen, Dr. (2)Fairul Afzal, Ahmad Fuad (2)Retnasamy, Vithyacharan (2)Vairavan, Rajendaran (2)Zaliman, Sauli, Dr. (2)... View MoreSubject
    Ansys (2)
    5mm × 5mm heat slug (1)Aluminum heat slug (1)Ball grid array (BGA) (1)Shear speed (1)... View MoreDate Issued2013 (2)

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