Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder

dc.contributor.author	Mohd Arif Anuar, Mohd Salleh
dc.contributor.author	Noraniza, Saud
dc.contributor.author	Najib Saedi, Ibrahim
dc.date.accessioned	2014-05-29T08:19:50Z
dc.date.available	2014-05-29T08:19:50Z
dc.date.issued	2013
dc.identifier.citation	Advanced Materials Research, vol.795, 2013, pages 522-525	en_US
dc.identifier.issn	1662-8985
dc.identifier.uri	http://www.scientific.net/AMR.795.522
dc.identifier.uri	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34873
dc.description	Link to publisher's homepage at http://www.scientific.net/	en_US
dc.description.abstract	Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.	en_US
dc.language.iso	en	en_US
dc.publisher	Trans Tech Publications	en_US
dc.subject	Aging	en_US
dc.subject	Composite	en_US
dc.subject	Intermetallic	en_US
dc.title	Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder	en_US
dc.type	Article	en_US
dc.identifier.url	10.4028/www.scientific.net/AMR.795.522
dc.contributor.url	arifanuar@unimap.edu.my	en_US