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    Research development of solder materials and its intermetallic compound (IMC) study 

    Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
    Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...

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    AuthorMohd Arif Anuar, Mohd Salleh (1)Mohd Mustafa Al Bakri, Abdullah (1)Najib Saedi, Ibrahim (1)Nik Noriman, Zulkepli (1)Ramani, Mayapan (1)... View MoreSubjectComposite (1)
    Intermetallic compound (1)
    Lead-Free solder (1)
    Solder fabrication (1)... View MoreDate Issued
    2012 (1)

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