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Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method
(Scientific.Net, 2012-04-12)
The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many ...
Research development of solder materials and its intermetallic compound (IMC) study
(Scientific.Net/Trans Tech Publications, 2012-12)
Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...
Research advances of composite solder material fabricated via powder metallurgy route
(Scientific.Net/Trans Tech Publications, 2012-12)
Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
(Scientific.Net, 2012-12)
Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ...