Browsing Nik Noriman Zulkepli, Assoc. Prof. Ts. Dr. by Author "arifanuar@unimap.edu.my"

Now showing items 1-8 of 8

    • The effect of different sizes "Batu Reput" (Dolomite) as a filler in SMR L and ENR-50 

      J. N., M. Ridhwan; Nik Noriman, Zulkepli, Dr.; Mohd Arif Anuar, Mohd Salleh; Sam, Sung Ting, Dr.; Luqman, Musa, Dr.; Nik Zakaria, Nik Yahya (Trans Tech Publications, 2013)
      The effects of different sizes of "Batu Reput" (Dolomite) filler which are smaller size (<63μm) and bigger size (75-150μm) on tensile and morphological properties of "Batu Reput" (Dolomite) filled SMR L and epoxidized ...

    • Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application 

      Aida Fakhrul, Lamakasauk; Nurul Shakina, Surani; Mohd Arif Anuar, Mohd Salleh; Nik Noriman, Zulkepli, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Rosniza, Hamzah; Mohamad, Abu Bakar (Macao Innovation & Invention Association, 2012-06-29)
      Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.

    • High temperature creep and hydrogen embrittlement failure of a steam trap bypass tube 

      Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Darwin, Sebayang, Ir. Ing. Prof. Dr; Nik Noriman, Zulkepli; Sitompul, Anton; DIC, Syahril (Trans Tech Publications, 2013)
      A coal fired power plant with its normal operation temperature of 540°C in which its steam trap bypass tube in that power plant was totally fractured. The aim of this study is to explore the evidence related to the steam ...

    • Natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) ternary blend: Curing characteristics and swelling test 

      Nik Zakaria, Nik Yahya; Nik Noriman, Zulkepli, Dr.; Mohd Arif Anuar, Mohd Salleh; Hanafi, Ismail, Prof.; Ragunathan, Santiagoo (Trans Tech Publications, 2014)
      Curing characteristics and swelling behavior of natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) blends were investigated. Eleven composition ratio; 50/50/0, 50/40/10, 50/30/20, 50/20/30, ...

    • Research advances of composite solder material fabricated via powder metallurgy route 

      Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...

    • Research development of solder materials and its intermetallic compound (IMC) study 

      Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...

    • Thermal properties of different recycled acrylonitrile-butadiene rubber glove (NBRr) size and its blend ratios on SBR/NBRr blends 

      Nik Noriman, Zulkepli, Dr.; Hanafi, Ismail; Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Rosniza, Hamzah (Trans Tech Publications, 2013-09)
      The effects of SBR/NBRr blends on thermal properties of such thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC) were carried out. Results showed that by incorporating the smallest size NBRr ...

    • Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder 

      Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Nik Noriman, Zulkepli, Dr.; Khairel Rafezi, Ahmad, Dr.; Mayappan, Ramani; Noor Farhani, Mohd Alui (Trans Tech Publications, 2013)
      Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ...