Now showing items 1-1 of 1

    • Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application 

      Aida Fakhrul, Lamakasauk; Nurul Shakina, Surani; Mohd Arif Anuar, Mohd Salleh; Nik Noriman, Zulkepli, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Rosniza, Hamzah; Mohamad, Abu Bakar (Macao Innovation & Invention Association, 2012-06-29)
      Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.