Now showing items 61-61 of 61

    • Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder 

      Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Nik Noriman, Zulkepli, Dr.; Khairel Rafezi, Ahmad, Dr.; Mayappan, Ramani; Noor Farhani, Mohd Alui (Trans Tech Publications, 2013)
      Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ...