Browsing Ong Hui Lin, Assoc. Prof. Dr. by Subject "Epoxy resin"
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Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
(SAGE Publications, 2007)Nanocomposite materials differ from the traditional composite materials in that they provide enhanced properties at comparatively low filler loading with respect to microsize filler. In this research work, silica filled ...