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Now showing items 31-40 of 56
A study on relationship between porosity and compressive strength for geopolymer paste
(Trans Tech Publications, 2013-12)
This paper presents a study on the relationship between porosity and compressive strength for geopolymer paste. In this research, geopolymer paste was made from fly ash class F based geopolymer mixed with alkaline activator; ...
First principle study of electronic structure, chemical bonding and optical properties of 5-azido-1H-tetrazole
(Electrochemical Science Group (ESG), 2013)
First principle calculations were performed to investigate the electronic band structure, density of states, charge density and optical properties of 5-azido-1H-tetrazole. The calculated band structure shows that the ...
Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
(Trans Tech Publications, 2013)
This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and ...
Roles of imputation methods for filling the missing values: A review
(AENSI Publisher All rights reserved, 2013-10)
Missing data are often encountered in many areas of research. Complete case analysis and indicator method can lead to serious bias. One of the comforting methods is implementation of imputation methods. The main purpose ...
Alkali activated blast-furnace slag cement: The opportunity to solve sustainable issues
(American-Eurasian Network for Scientific Information, 2013)
This paper aimed at investigating the possibility of alkali activated blast-furnace
slag (BFS) to produce cement powder that could be alternative to ordinary Portland
cement. It was found that an alkali activated BFS ...
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
(Trans Tech Publications, 2013)
Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver ...
The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
(Trans Tech Publications, 2013)
The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel ...
The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™
(AENSI Publisher All rights reserved, 2013-10)
This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and ...
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
(Trans Tech Publications, 2013)
Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid ...
Batu Reput filled recycled polypropylene eco-polymer composites
(American-Eurasian Network for Scientific Information, 2013)
The effect of Batu Reput, which scientifically called as Dolomite mineral filler on
the mechanical properties of recycled polypropylene (rPP) mixed using Z-blade
mixer was examined. This research has been done to investigate ...