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Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
(Emerald Group Publishing, 2006)
Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ...
Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)
Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...