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Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)
Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...
Experimental investigation of the performance of a triple concentric pipe heat exchanger
(Elsevier Ltd., 2013)
The performance of a triple concentric pipe heat exchanger is studied experimentally under steady state conditions for two different flow arrangements, called N-H-C and C-H-N, and for insulated as well as non-insulated ...
Optimization of EDM process parameters using Taguchi method
(Universiti Malaysia Perlis (UniMAP), 2012-02-27)
This paper presents investigation and optimization of Electric Discharge Machining (EDM) parameters using Taguchi method. Three process parameters chosen were Pulse on-time (Ton), Duty factor and Discharge current (or pulse ...
Heat transfer analysis in an annular cone fixed with saturated porous medium
(Universiti Malaysia Perlis (UniMAP), 2012-02-27)
The present work concerns with the heat
transfer by natural convection and radiation in an annular
cone fixed with saturated porous medium. The Darcy
model is used to predict the heat transfer behavior in the
porous ...
Taguchi based grey relational analysis for multi-performance optimization of slab milling process parameters
(Universiti Malaysia Perlis (UniMAP), 2012-02-27)
Taguchi based grey relational analysis is used to optimize multi-performance characteristic of CNC slab milling process parameters for machining ASTM A572 grade 50 high strength low alloy (HSLA) steel plates. Four process ...
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)
Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...