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FEM analysis of multifluid heat exchangers
(Emerald Group Publishing Limited, 2004)
Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ...
Flip chip thermal test vehicle design: Requirements, evaluations, and validations
(ASME, 2003)
This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ...
Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
(Emerald Group Publishing Limited, 2005)
Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ...
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
(Emerald Group Publishing Limited, 2005)
Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ...
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
(Emerald Group Publishing Limited, 2004)
This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...
Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
(Emerald Group Publishing Limited, 2004)
This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...
Test chip and substrate design for flip chip microelectronic package thermal measurements
(Emerald Group Publishing Limited, 2006)
Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...
Fast transient solutions for heat transfer [FEM]
(IEEE Conference Publications, 2003)
The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...
Optimization of liquid cooling fins in microelectronic packaging
(Taylor & Francis Online, 2005)
The present study investigates the heat transfer from a fin of the combination of cone and frustum of a cone immersed in boiling FC-72. The temperature distribution within the fin is determined with the help of a ...
Plant based energy potential and biomass utilization in Malaysia
(Regional Energy Resources Information Center (RERIC), 2000-12)
The paper assesses the energy productivity of the major plantation crops in Malaysia as well as the status of bioenergy utilization in the country. Of the crops studied and under present local cultivation practices, oil ...