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Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
(Emerald Group Publishing Limited, 2005)
Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ...
Numerical and experimental heat transfer studies on totally enclosed fan ventilated machines
(Taylor and Francis Group, LLC, 2002)
Accurate prediction of temperature distribution in an electrical machine at the design stage is becoming increasingly important. It is essential to know the locations and magnitudes of hot spot temperatures for optimum ...
Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)
Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...
Flow analysis for flip chip underfilling process using characteristic based split method
(IEEE Conference Publications, 2004)
In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...
Transient analysis of a liquid solar collector
(Elsevier Ltd., 2005)
An unsteady state analysis of a liquid solar collector is presented. The physical parameters, which govern the system, are identified. The governing equations have been solved using the fourth order Runge-Kutta method for ...