Browsing Ghulam Abdul Quadir, Prof. Dr. by Author "knseetharamu@hotmail.com"

Now showing items 1-20 of 21

    • Fast transient solutions for heat transfer [FEM] 

      Ooi, Chen Hee; Seetharamu, Kankanhally N.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Sim, K. S.; Goh, Teck Joo (IEEE Conference Publications, 2003)
      The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...

    • FEM analysis of multifluid heat exchangers 

      Seetharamu, Kankanhally N.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Krishnan, Ganapathi M. (Emerald Group Publishing Limited, 2004)
      Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ...

    • Finite element modelling of solidification phenomena 

      Seetharamu, Kankanhally N.; Paragasam, R.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Prasad, B. S.; Sundararajan, Thirumalachari (Springer India, 2001)
      The process of solidification process is complex in nature and the simulation of such process is required in industry before it is actually undertaken. Finite element method is used to simulate the heat transfer process ...

    • Flip chip thermal test vehicle design: Requirements, evaluations, and validations 

      Goh, Teck Joo; Chu, Chia Pin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (ASME, 2003)
      This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ...

    • Flow analysis for flip chip underfilling process using characteristic based split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Aswatha Narayana, P. A.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2004)
      In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...

    • Modeling of wire-on-tube heat exchangers using finite element method 

      Ghulam, Abdul Quadir, Prof. Dr.; Krishnan, Ganapathi M.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2002)
      Wire-on-tube heat exchangers are analysed under normal operating conditions (free convection) using finite element method. Galerkin's weighted residual method is used to minimise the errors. The effects of ambient temperatures ...

    • Numerical and experimental heat transfer studies on totally enclosed fan ventilated machines 

      Rajagopal, M. S.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Taylor and Francis Group, LLC, 2002)
      Accurate prediction of temperature distribution in an electrical machine at the design stage is becoming increasingly important. It is essential to know the locations and magnitudes of hot spot temperatures for optimum ...

    • Numerical simulation of underfill encapsulation process based on characteritsic split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)
      Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...

    • Optimization of fins used in electronic packaging 

      Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)
      Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...

    • Optimization of PCB component placement using genetic algorithm 

      Jeevan, Kanesan; Parthiban, A.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (World Scientific Publishing, 2002)
      This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ...

    • Optimization of thermal resistance of stacked micro-channel using genetic algorithms 

      Jeevan, Kanesan; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ...

    • Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages 

      Ghulam, Abdul Quadir, Prof. Dr.; Leong, C.B.; Krishnan, G.M.; Seetharamu, Kankanhally N. (IEEE Conference Publications, 2000)
      In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure ...

    • Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan (Emerald Group Publishing Limited, 2004)
      This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...

    • Steady and unsteady thermal analysis of a triple stack cold plate with heat losses 

      Beh, Shiao Lin; Ooi, Chen Hee; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Emerald Group Publishing Limited, 2005)
      Purpose - To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach - A detailed finite element formulation for the triple stack cold plate with and without heat losses ...

    • Steady state finite element analysis of a double stack cold plate with heat losses 

      Ghulam, Abdul Quadir, Prof. Dr.; Beh, Shiao Lin; Seetharamu, Kankanhally N.; Ahmad Yusoff, Hassan (Springer-Verlag, 2003)
      A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted ...

    • Test chip and substrate design for flip chip microelectronic package thermal measurements 

      Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2006)
      Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...

    • Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM 

      Hegde., Pradeep G.; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Aswatha Narayana, P. A.; Mohd Zulkifly, Abdullah; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ...

    • Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan (Emerald Group Publishing Limited, 2004)
      This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...

    • Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms 

      Jeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...

    • Thermal management of multichipmodule (MCM) using genetic algorithms 

      Jeevan, Kanesan; Seetharamu, Kankanhally N.; Ishak, I.A.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2003)
      The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ...