Browsing Institute of Nano Electronic Engineering (Theses) by Subject "Bonding wires"
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Wearout reliability studies of bonding wires used in nano electronic device packaging
(Universiti Malaysia Perlis (UniMAP)Institute of Nano Electronic Engineering, 2014)Conventional bare Cu bonding wires, in general, are more susceptible to moisture corrosion compared to gold (Au) and Cu wires. There is very limited knowledge based reliability studies which have been carried out on 1st ...