Browsing Universiti Malaysia Perlis by Subject "Intermetallic compound (IMC)"
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Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
(Universiti Malaysia Perlis (UniMAP), 2015-04-17)Conventionally, Sn-Pb types of solder were highly used in the electronic packaging industries as it excels in most of its properties. But, then it was realized that lead (Pb) were hazardous to the invironment and human ...