Browsing Conference Papers by Author "Ibrahim, Ahmad"
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The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim (Universiti Putra Malaysia (UPM), 2005-12-06)The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ... -
A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility
Mohd Azizi, Chik; Ve, Chun Yung; Balakrishna, Puvaneswaran; Uda, Hashim, Prof. Dr.; Ibrahim, Ahmad; Bashir, Mohamad (Institute of Electrical and Electronics Engineers (IEEE), 2010-06-28)This research is to study the opportunity to achieve optimum productivity yield in 0.16μm product mixed through understanding the impact of loading utilization towards the capacity. The study is important to model the ...