dc.contributor.author | Noor Rehan, Zainal Abidin | |
dc.contributor.author | Cheong, Kuan Yew, Dr. | |
dc.contributor.author | Lockman, Zainovia | |
dc.date.accessioned | 2012-05-28T14:05:48Z | |
dc.date.available | 2012-05-28T14:05:48Z | |
dc.date.issued | 2009-07 | |
dc.identifier.citation | p. 8, 10, 12, 14 | en_US |
dc.identifier.issn | 0126-9909 | |
dc.identifier.uri | http://www.myiem.org.my/content/iem_bulletin_2009-184.aspx | |
dc.identifier.uri | http://dspace.unimap.edu.my/123456789/19361 | |
dc.description | Link to publisher’s homepage at http://www.myiem.org.my/ | en_US |
dc.language.iso | en | en_US |
dc.publisher | The Institution of Engineers, Malaysia | en_US |
dc.relation.ispartofseries | Jurutera | en_US |
dc.relation.ispartofseries | 2009 (7) | en_US |
dc.subject | High temperature electronic (HTE) | en_US |
dc.subject | Semiconductor | en_US |
dc.subject | Wide band gap (WBG) | en_US |
dc.subject | Silicon carbide (SiC) | en_US |
dc.title | Material selection for high temperature electronic devices and its potential applications | en_US |
dc.type | Article | en_US |