Uda Hashim, Prof. Ts. Dr.: Recent submissions
Now showing items 241-244 of 244
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The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ... -
High speed and low power devices : bulk silicon versus SOI
(Kolej Universiti Kejuruteraan Utara Malaysia, 2005-04) -
From sand to Silicon wafer
(Kolej Universiti Kejuruteraan Utara Malaysia, 2003-07) -
Quantum DOT Single Electron Transistor
(School of Microelectronic Engineering, 2008-01-09)