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Extended reliability of gold and copper ball bonds in microelectronic packaging
(World Gold Council, 2013-06)
Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years ...
Further optical properties of CdX (X¼ S, Te) compounds under quantum dot diameter effect: Ab initio method
(Elsevier Ltd., 2012-09)
For energy band calculations, the indirect energy gap (G X) is calculated using density functional theory
(DFT) of the full potential-linearized augmented plane wave (FP-LAPW) method as implemented in
WIEN2K code. The ...
Fabrication and characterization of 50 nm silicon nano-gap structures
(American Scientific Publishers, 2011-04)
A simple method for the fabrication of nano-gaps less than 50 nm by using conventional photolithography combined with patterned-size reduction techniques is presented. Silicon material is used to fabricate the nano-gap ...
Theoretical and experimental study towards fabrication of nanogap dielectric biosensor by reversed spacer lithography
(American Institute of Physics, 2010-03-11)
A reversed spacer patterning technology using a sacrificial layer and a chemical vapor deposition (CVD) spacer layer has been developed, and is demonstrated to achieve sub-50 nm structures with conventional dry etching. ...
Precise alignment of individual single-walled carbon nanotube using dielectrophoresis method for development and fabrication of pH sensor
(Hindawi Publishing Corporation, 2013)
Development and fabrication of single-walled carbon nanotube (SWNT) based pH sensor were reported. The precise alignment of individual SWNT using dielectrophoresis method between the two microgap electrodes was conducted, ...
Micropump pattern replication using Printed Circuit Board (PCB) technology
(Taylor and Francis Group, LLC., 2013-06-01)
This article shows a low-cost rapid hot embossing poly (methylmeth acrylate) (PMMA)-based micropump replication with printed circuit board (PCB) mold. PCB material offers advantages of low cost, rigid, and rapid thermal ...
Modular architecture of a non-contact pinch actuation micropump
(MDPI, Basel, Switzerland., 2012-09)
This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in ...
Highly selective molecular imprinted polymer (MIP) based sensor array using interdigitated electrode (IDE) platform for detection of mango ripeness
(Elsevier B.V., 2013)
Detection of mango ripeness was performed by developing a highly selective molecularly imprinted polymers (MIP) layer combined with interdigitated electrode (IDE) as sensor. Mango volatiles from different week of ripeness ...
Bidirectional flow micropump based on dynamic rectification
(Elsevier B.V., 2013)
This paper proposes a new bidirectional pumping principle based on a dynamic rectification mechanism. The pump is composed of a moveable actuation platform and a gourd-shaped chamber, whose role is to behave as both a ...
Fabrication of silicon nitride ion sensitive field-effect transistor for pH measurement and DNA immobilization/hybridization
(Hindawi Publishing Corporation, 2013)
The fabrication of ion sensitive field-effect transistor (ISFET) using silicon nitride (Si3N4) as the sensing membrane for pH measurement and DNA is reported. For the pH measurement, the Ag/AgCl electrode was used as the ...