Browsing Uda Hashim, Prof. Ts. Dr. by Subject "Wafer bumping"
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The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
(Universiti Putra Malaysia (UPM), 2005-12-06)The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ... -
Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
(Department of Mechanical Engineering, University Malaya, 2007)Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size ...