Now showing items 1-2 of 2

    • The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) 

      Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim (Universiti Putra Malaysia (UPM), 2005-12-06)
      The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ...
    • Influence of current density on porous silicon characteristics 

      Husnen R., Abd; Naser Mahmoud, Ahmed, Dr.; Yarub, Al-Douri, Assoc. Prof. Dr.; Uda, Hashim, Prof. Dr. (Trans Tech Publications, 2013)
      Porous silicon structures have been fabricated by electrochemical etching using different current density. From field emission scanning electron microscope images (FE-SEM) it was observed that more uniform distribution of ...