Browsing Uda Hashim, Prof. Ts. Dr. by Subject "Intermetallic growth"
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Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
(University of Malaya, 2008)In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ... -
Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
(The Electrochemical Society, 2009-03-17)This paper presents the study of the thermal aging of the gold ball bonds and aluminum bond pad at 150 °C and 200 °C for various interval times. Process decapsulation and Field Emission Scanning Electron Microscopy (FESEM) ...