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Microstructure evolution of Ag/TiO₂ thin film
(MDPI AG, 2021-01)
Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure ...
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
(MDPI AG, 2021-02)
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ...