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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2013)
The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
(Syscom 18 SRL, 2013-07)
The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ...
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
(Trans Tech Publications, 2013)
To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ...