Browsing Researchers by Author "gaquadir@unimap.edu.my"
Now showing items 1-20 of 32
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Analysis of microchannel heat exchangers using FEM
Ghulam, Abdul Quadir, Prof. Dr.; Mydin, Anvar; Seetharamu, Kankanhally N. (Emerald Group Publishing, 2000)A finite element method is applied to evaluate the performance of microchannel heat exchangers that are used in electronic packaging. The present approach is validated against the CFD data available in the literature. A ... -
Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
Lee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Goh, Teck Joo (Emerald Group Publishing, 2006)Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ... -
Application of artificial neural network for fatigue life prediction
Ishak, Abdul Azid, Dr.; Lee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr. (Trans Tech Publications, 2005)An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the ... -
Experimental investigation of a downdraft biomass gasifier
Zainal Alimuddin, Zainal Alauddin, Dr.; Ali, Rifau; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2002)An experimental investigation of a downdraft biomass gasifier is carried out using furniture wood and wood chips. The effect of equivalence ratio on the gas composition, calorific value and the gas production rate is ... -
Experimental investigation of the performance of a triple concentric pipe heat exchanger
Quadir, Abdul Quadir, Prof. Dr.; Jarallah, Saqab S.; Ahmed, Naveed J Salman; Badruddin, I. A. (Elsevier Ltd., 2013)The performance of a triple concentric pipe heat exchanger is studied experimentally under steady state conditions for two different flow arrangements, called N-H-C and C-H-N, and for insulated as well as non-insulated ... -
Fast transient solutions for heat transfer [FEM]
Ooi, Chen Hee; Seetharamu, Kankanhally N.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Sim, K. S.; Goh, Teck Joo (IEEE Conference Publications, 2003)The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ... -
FEM analysis of multifluid heat exchangers
Seetharamu, Kankanhally N.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Krishnan, Ganapathi M. (Emerald Group Publishing Limited, 2004)Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ... -
Finite element modelling of solidification phenomena
Seetharamu, Kankanhally N.; Paragasam, R.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Prasad, B. S.; Sundararajan, Thirumalachari (Springer India, 2001)The process of solidification process is complex in nature and the simulation of such process is required in industry before it is actually undertaken. Finite element method is used to simulate the heat transfer process ... -
Flip chip thermal test vehicle design: Requirements, evaluations, and validations
Goh, Teck Joo; Chu, Chia Pin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (ASME, 2003)This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ... -
Flow analysis for flip chip underfilling process using characteristic based split method
Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Aswatha Narayana, P. A.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2004)In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ... -
Modeling of wire-on-tube heat exchangers using finite element method
Ghulam, Abdul Quadir, Prof. Dr.; Krishnan, Ganapathi M.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2002)Wire-on-tube heat exchangers are analysed under normal operating conditions (free convection) using finite element method. Galerkin's weighted residual method is used to minimise the errors. The effects of ambient temperatures ... -
Numerical analysis and experimental investigation into the performance of a wire-on-tube condenser of a retrofitted refrigerator
Ameen, Ahmadul; Mollik, , S. A.; Mahmud, Khizir; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2006)The present paper discusses (a) the analysis of a wire-on-tube condenser under varying operating conditions of free convection using FEM, and (b) experimental verification of the performance of two wire-on-tube condensers ... -
Numerical and experimental heat transfer studies on totally enclosed fan ventilated machines
Rajagopal, M. S.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Taylor and Francis Group, LLC, 2002)Accurate prediction of temperature distribution in an electrical machine at the design stage is becoming increasingly important. It is essential to know the locations and magnitudes of hot spot temperatures for optimum ... -
Numerical simulation of underfill encapsulation process based on characteritsic split method
Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ... -
Optimization of EDM process parameters using Taguchi method
Azizul, Mohamad; Arshad, Noor Siddiquee; Ghulam, Abdul Quadir (Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)This paper presents investigation and optimization of Electric Discharge Machining (EDM) parameters using Taguchi method. Three process parameters chosen were Pulse on-time (Ton), Duty factor and Discharge current (or pulse ... -
Optimization of fins used in electronic packaging
Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ... -
Optimization of PCB component placement using genetic algorithm
Jeevan, Kanesan; Parthiban, A.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (World Scientific Publishing, 2002)This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ... -
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
Jeevan, Kanesan; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2005)Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ... -
Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages
Ghulam, Abdul Quadir, Prof. Dr.; Leong, C.B.; Krishnan, G.M.; Seetharamu, Kankanhally N. (IEEE Conference Publications, 2000)In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure ... -
Plant based energy potential and biomass utilization in Malaysia
Lee, Koon Ong; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Quadir, Prof. Dr.; Mohd Zulkifly, Abdullah (Regional Energy Resources Information Center (RERIC), 2000-12)The paper assesses the energy productivity of the major plantation crops in Malaysia as well as the status of bioenergy utilization in the country. Of the crops studied and under present local cultivation practices, oil ...