Browsing Researchers by Author "Uda"
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Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
Chong, Leong Gan; Uda (Springer Science+Business Media New York, 2013-08)Extended reliability and mechanical characterisation of Au and Pd-coated Cu (Cu) ball bonds are useful technical information for Au and Cu wire deployment in semiconductor device packaging. This paper discusses the influence ...