Browsing Researchers by Author "Palianysamy, Moganraj"

Now showing items 1-4 of 4

    • Aluminium surface grain size analysis on RIE treatment 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow (Trans Tech Publications (TTP), 2013)
      Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ...

    • Simulation and characterization of MEMS piezoelectric thermal actuator 

      Palianysamy, Moganraj; Raman, Sathisvaran; Hasnizah, Aris; Retnasamy, Vithyacharan (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      The development of low cost MEMS devices has been the main focus in recent years. This leads to discovery of MEMS materials and suitable devices. Magnetostatic and electrostatic actuators produce relatively small forces; ...

    • Wettability and surface roughness study on RIE treated aluminium deposited surface 

      Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Uda, Hashim, Prof. Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; Ramzan, Mat Ayub (Trans Tech Publications, 2014-04)
      Design of Experiment (DOE) is a technique for optimizing process which has controllable inputs and measurable outputs. As a method of DOE, 24 Full Factorial design is used to study the effect of Reactive Ion Etch towards ...

    • Wire bond shear test simulation on hemispherical surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Wan Mokhzani, Wan Norhaimi; Johari, Adnan, Assc. Prof. Dr.; Palianysamy, Moganraj (Trans Tech Publications, 2012-12)
      Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...