Browsing School of Materials Engineering (FYP) by Author "Chuah Run Yi"
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Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
Chuah Run Yi (Universiti Malaysia PerlisSchool of Materials Engineering, 2008-03)Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as CuSiC, is a highly potential heat spreader material ...